Communication relays will continue to grow in the futur […]
Communication relays will continue to grow in the future, accounting for a quarter of the global relay market. High-frequency relays are the main direction of its development. Driven by the needs of telecommunications, wireless communications, and broadband transmission access, it has become a new platform for the replacement of electromechanical relays and a booster for the acceleration of next-generation communication technologies.
Communication relays with smaller size, suitable for surface mounting, high reliability, and excellent anti-interference performance are in great demand; the fourth generation of new communication relays required for future 4G development will become the mainstream of its development.
The fourth-generation communication relay technology has matured day by day, and the development of the third-generation mobile communication provides a good market prospect for it.
Automotive relay sales account for more than 20% of total relay sales. Due to the re-division of the world's automobile manufacturing layout, the production and sales of automotive relays in my country will develop at an annual rate of not less than 15%. Its development trend is combination, that is, the integration of traditional switch relays and microelectronics technology, expand its functions, and transform from control "components" to control "devices". Electric, hybrid, and new energy vehicles are new directions for their applications, and electromagnetic compatibility and technical applicability will become the key. Miniaturization, high current (load), low power consumption, high sensitivity, high reliability, functional combination, low cost, light weight, good electromagnetic compatibility, flame retardancy, and applicability against harsh environments are the mainstream of development direction.
Solid state relays (SSR) account for 15% of the global relay market, and are still growing strongly, and the momentum is not diminished. It is expected to reach more than 20% in the next few years. Miniaturization and low cost are the directions to be overcome for its general application, and the improvement of the packaging process is the main direction to improve its environmental adaptability and high reliability.
Optical relays/microelectronic relays are necessary for the development of electronic products in the direction of digitization, automation, and ultra-miniaturization. Due to its advantages of low leakage rate, good isolation performance, and stable and excellent output characteristics, photorelays/microelectronic relays have been expanding their application fields. The photorelay suitable for the "Internet of Things" has become the preferred product due to its high sensitivity and high reliability, and will be an important direction for the development of the next generation of relays.
The electromechanical-solid combined relay is a combination product that has both advantages and avoids its shortcomings. It has become a large number of devices in some application fields. The technical characteristics of complementary advantages have become a development trend in the future.
Surface mount relays have been widely promoted because they meet the needs of large-scale, high-precision production. Lead-free relays have become the development direction of relay manufacturing technology and process due to adapting to environmental protection requirements.